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| Preliminary data BUZ 102S-4 SIPMOS (R) Power Transistor * Quad-channel * Enhancement mode * Avalanche-rated * dv/dt rated Type BUZ 102S-4 VDS 55 V ID 6.4 A RDS(on) 0.028 Package P-DSO-28 Ordering Code C67078-S. . . . -A.. Maximum Ratings Parameter Continuous drain current one channel active Symbol Values 6.4 Unit A ID IDpuls 25.6 TA = 25 C Pulsed drain current one channel active TA = 25 C Avalanche energy, single pulse EAS 245 dv/dt 6 mJ ID = 6.4 A, VDD = 25 V, RGS = 25 L = 12 mH, Tj = 25 C Reverse diode dv/dt kV/s IS = 6.4 A, VDS = 40 V, diF/dt = 200 A/s Tjmax = 175 C Gate source voltage Power dissipation ,one channel active VGS Ptot 20 2.4 V W TA = 25 C Operating temperature Storage temperature IEC climatic category, DIN IEC 68-1 Tj Tstg -55 ... + 175 -55 ... + 175 55 / 175 / 56 C Semiconductor Group 1 07/Oct/1997 Preliminary data BUZ 102S-4 Thermal Characteristics Parameter Symbol min. Thermal resistance, junction - soldering point 1) Thermal resistance, junction - ambient 2) Values typ. max. tbd 62.5 K/W Unit RthJS RthJA - 1) Device on 50mm*50mm*1.5mm epoxy PCB FR4 with 6 cm2 (one layer,70m thick) copper area for Drain connection. PCB is vertical without blown air. 2) one channel active Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Static Characteristics Drain- source breakdown voltage Values typ. max. Unit V(BR)DSS 55 3 0.1 10 0.02 4 V VGS = 0 V, ID = 0.25 mA, Tj = 25 C Gate threshold voltage VGS(th) 2.1 VGS=VDS, ID = 90 A Zero gate voltage drain current IDSS 0.1 1 100 A VDS = 55 V, VGS = 0 V, Tj = -40 C VDS = 55 V, VGS = 0 V, Tj = 25 C VDS = 55 V, VGS = 0 V, Tj = 150 C Gate-source leakage current IGSS 100 nA 0.028 VGS = 20 V, VDS = 0 V Drain-Source on-resistance RDS(on) VGS = 10 V, ID = 6.4 A Semiconductor Group 2 07/Oct/1997 Preliminary data BUZ 102S-4 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Dynamic Characteristics Transconductance Values typ. max. Unit gfs 8 1220 410 210 - S pF 1525 515 265 ns 20 30 VDS 2 * ID * RDS(on)max, ID = 6.4 A Input capacitance Ciss Coss - VGS = 0 V, VDS = 25 V, f = 1 MHz Output capacitance VGS = 0 V, VDS = 25 V, f = 1 MHz Reverse transfer capacitance Crss - VGS = 0 V, VDS = 25 V, f = 1 MHz Turn-on delay time td(on) VDD = 30 V, VGS = 10 V, ID = 6.4 A RG = 7.1 Rise time tr 22 33 VDD = 30 V, VGS = 10 V, ID = 6.4 A RG = 7.1 Turn-off delay time td(off) 60 90 VDD = 30 V, VGS = 10 V, ID = 6.4 A RG = 7.1 Fall time tf 30 2.5 35 45 4 45 nC 3.75 52 68 V - VDD = 30 V, VGS = 10 V, ID = 6.4 A RG = 7.1 Gate charge at threshold Qg(th) Qg(7) - VDD = 40 V, ID 0.1 A, VGS =0 to 1 V Gate charge at 7.0 V VDD = 40 V, ID = 6.4 A, VGS =0 to 7 V Gate charge total Qg(total) - VDD = 40 V, ID = 6.4 A, VGS =0 to 10 V Gate plateau voltage V(plateau) VDD = 40 V, ID = 6.4 A Semiconductor Group 3 07/Oct/1997 Preliminary data BUZ 102S-4 Electrical Characteristics, at Tj = 25C, unless otherwise specified Parameter Symbol min. Reverse Diode Inverse diode continuous forward current IS A 0.9 60 0.15 6.4 25.6 V 1.6 ns 90 C 0.23 Values typ. max. Unit TA = 25 C Inverse diode direct current, pulsed ISM - TA = 25 C Inverse diode forward voltage VSD trr Qrr VGS = 0 V, IF = 12.8 A Reverse recovery time VR = 30 V, IF=lS, diF/dt = 100 A/s Reverse recovery charge VR = 30 V, IF=lS, diF/dt = 100 A/s Semiconductor Group 4 07/Oct/1997 Preliminary data BUZ 102S-4 Power dissipation Ptot = (T) Drain current ID = (TC) parameter: VGS 10 V 6.5 A 5.5 2.6 W 2.2 RthJC thJA Ptot 2.0 1.8 1.6 1.4 1.2 1.0 0.8 0.6 0.4 0.2 0.0 0 20 40 60 80 100 120 140 C T 180 ID 5.0 4.5 4.0 3.5 3.0 2.5 2.0 1.5 1.0 0.5 0.0 0 20 40 60 80 100 120 140 C 180 TC Semiconductor Group 5 07/Oct/1997 Preliminary data BUZ 102S-4 Typ. output characteristics ID = (VDS) parameter: tp = 80 s , Tj = 25 C 15 A 13 l Typ. drain-source on-resistance RDS (on) = (ID) parameter: tp = 80 s, Tj = 25 C 0.09 j k h f ige d Ptot = 2W VGS [V] a 4.0 a ID 12 11 10 9 8 7 6 5 4 3 2 c RDS (on)0.07 0.06 0.05 b b c d e f g h i 4.5 5.0 5.5 6.0 6.5 7.0 7.5 8.0 9.0 10.0 20.0 0.04 c b j k l 0.03 0.02 0.01 VGS [V] = a 4.5 4.0 5.0 b 5.5 c 6.0 d 6.5 e f 7.0 7.5 g 8.0 h i j 9.0 10.0 20.0 d fe g ih j 1 0 0.0 0.5 1.0 1.5 2.0 2.5 3.0 3.5 4.0 a V 5.0 0.00 0 2 4 6 8 A 12 VDS ID Typ. transfer characteristics ID = f (VGS) parameter: tp = 80 s VDS2 x ID x RDS(on)max 90 A ID 70 60 50 40 30 20 10 0 0 1 2 3 4 5 6 7 8 V VGS 10 Semiconductor Group 6 07/Oct/1997 Preliminary data BUZ 102S-4 Drain-source on-resistance RDS (on) = (Tj) parameter: ID = 6.4 A, VGS = 10 V 0.080 Gate threshold voltage VGS (th) = (Tj) parameter: VGS = VDS, ID = 90 A 4.6 V 4.0 RDS (on) 0.060 VGS(th) 98% 3.6 3.2 typ 0.050 2.8 0.040 98% 2.4 2.0 2% 0.030 typ 1.6 1.2 0.8 0.020 0.010 0.4 0.000 -60 -20 20 60 100 C 180 0.0 -60 -20 20 60 100 C 180 Tj Tj Typ. capacitances C = f (VDS) parameter:VGS = 0V, f = 1MHz 10 4 Forward characteristics of reverse diode IF = (VSD) parameter: Tj, tp = 80 s 10 2 A C pF IF 10 1 Ciss 10 3 10 0 Coss Tj = 25 C typ Tj = 175 C typ Tj = 25 C (98%) Tj = 175 C (98%) 10 -1 0.0 Crss 10 2 0 5 10 15 20 25 30 V 40 VDS 0.4 0.8 1.2 1.6 2.0 2.4 V 3.0 VSD Semiconductor Group 7 07/Oct/1997 Preliminary data BUZ 102S-4 Avalanche energy EAS = (Tj) parameter: ID = 6.4 A, VDD = 25 V RGS = 25 , L = 12 mH 260 mJ 220 Typ. gate charge VGS = (QGate) parameter: ID puls = 6 A 16 V EAS 200 180 160 140 VGS 12 10 8 120 100 80 60 40 20 0 20 40 60 80 100 120 140 C 180 0 0 10 20 30 40 50 nC 65 4 6 0,2 VDS max 0,8 VDS max 2 Tj QGate Drain-source breakdown voltage V(BR)DSS = (Tj) 65 V V(BR)DSS 61 59 57 55 53 51 49 -60 -20 20 60 100 C 180 Tj Semiconductor Group 8 07/Oct/1997 |
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